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Title:
SUBSTRATE TREATMENT DEVICE
Document Type and Number:
Japanese Patent JP2004288860
Kind Code:
A
Abstract:

To provide a substrate treatment device in which a substrate is not required to be rotated even when fluid is required to be supplied from a plurality of different directions toward the surface of the substrate in order that the substrate is treated in good order.

A water jet head 4 comprises pure water outlets 423, 443 facing with each other in an X-axis direction and pure water outlets 433, 454 facing with each other in a Y-axis direction. Pure water supplied to the upper surface of the substrate from the outlets 423, 443 forms water flows thereon in a positive direction and a negative direction, respectively, along the X-axis direction. Pure water supplied to the upper surface of a wafer W from the outlets 453, 433 forms water flows on the upper surface of the substrate in a positive direction and a negative direction along the Y-axis direction. While a laser beam is irradiated on the substrate, pure water is sequentially discharged from the outlets 423, 433, 443, 453.


Inventors:
Ogawa, Yoichi
Kobayashi, Masayoshi
Application Number:
JP2003000078669
Publication Date:
October 14, 2004
Filing Date:
March 20, 2003
Export Citation:
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Assignee:
DAINIPPON SCREEN MFG CO LTD
International Classes:
H01L21/302; H01L21/027; H01L21/304; H01L21/02; (IPC1-7): H01L21/304; H01L21/027; H01L21/302