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Title:
SUBSTRATE TREATMENT DEVICE
Document Type and Number:
Japanese Patent JPH11204413
Kind Code:
A
Abstract:

To reduce burden on an operator, by starting control to change a a preset temperature of a heat treatment section, and thus changing the preset temperature of the heat treatment section to a treatment temperature before starting treatment of an allocation object lot.

On the basis of a preset temperature and a status of use of respective heat treatment sections HP1-HP8 before starting treatment of a #2 lot to be treated under input treatment conditions, a main controller allocates a heat treatment section HP to be used for each heat treatment of the #2 lot, using the treatment temperature of each heat treatment included in the input treatment conditions for the #2 lot. Then, it starts control to change the preset temperatures of the heat treatment sections HP5, HP6, and HP8 for a #1 lot corresponding to each heat treatment of the #2 lot, and thus changes the preset temperatures to the treatment temperature of each heat treatment of the #2 lot corresponding thereto.


Inventors:
HISAI AKIHIRO
Application Number:
JP717998A
Publication Date:
July 30, 1999
Filing Date:
January 19, 1998
Export Citation:
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Assignee:
DAINIPPON SCREEN MFG
International Classes:
H01L21/027; H01L21/324; (IPC1-7): H01L21/027; H01L21/324
Attorney, Agent or Firm:
Tsutomu Sugitani



 
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