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Patent Searching and Data


Title:
SUBSTRATE TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2002050607
Kind Code:
A
Abstract:

To provide a substrate treatment method which can prevent metal impurity ions from attaching, without corroding metallic wirings, etc., in a substrate surface, and can improve the cleanliness level of a substrate by surely removing particle and metal impurities which attach to a recess and a step part generated in a metal wiring.

A substrate 1 is treated in a first process A for cleaning with organic alkaline treatment liquid, a second process B for cleaning after the first process by means of organic acid treatment liquid and a third process C for cleaning, after the second process by means of ultrasound cleaning fluid oscillated by ultrasonic wave. An organic alkaline treatment liquid and organic acid treatment liquid are non-reactive to a metallic material of a metal wiring of the substrate 1 and can improve the cleanliness level of the substrate 1, by preventing metal impurity ions from attaching, without corroding the metal wrings, etc., of a substrate surface; since it contains complexing agent which forms a complex with particles in a metallic material and metals included in polishing solution, when the substrate 1 is chemomechanically polished.


Inventors:
OKANO KATSUICHI
ECHIGO TOMOMI
OSAWA TADAYASU
Application Number:
JP2000000236082
Publication Date:
February 15, 2002
Filing Date:
August 03, 2000
Export Citation:
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Assignee:
KAIJO KK
International Classes:
C23G1/02; C23G1/14; H01L21/304; H01L21/306; (IPC1-7): H01L21/304; C23G1/02; C23G1/14; H01L21/306
Attorney, Agent or Firm:
Shoji Hagiri