Title:
SUBSTRATE TREATMENT PROCESS MONITORING DEVICE, AND DEVICE MANUFACTURING METHOD USING IT
Document Type and Number:
Japanese Patent JP3927629
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To detect changes in pattern formation state and to manage process with sure and promptly, by irradiating a periodic pattern formed on a substrate with an incident light flux, photo-detecting a signal light flux from the pattern, for obtaining pattern's formation state.
SOLUTION: A pattern comprising an L and S pattern drawn on a reticule is, by step and repeat method, sequentially poured, for exposure, on a wafer coated with a resist. The resist on the wafer after exposure has latent images 301-309 in the resist. The latent images 301-309 are, by exposure light, constituted through resist's chemical change, etc., for property change, with the oblique line part being exposed part. Generally, refraction factor is changed. If abnormality exists with an exposure device at this stage, these latent images 301-309 are different in shape, so the results of measuring pattern's formation state are different. Thereby, changes in pattern formation state are detected, for process management.
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Inventors:
Seiji Takeuchi
Hiroshi Maehara
Hiroshi Maehara
Application Number:
JP26438396A
Publication Date:
June 13, 2007
Filing Date:
October 04, 1996
Export Citation:
Assignee:
Canon Inc
International Classes:
H01L21/02; H01L21/66; H01L21/027; (IPC1-7): H01L21/02; H01L21/027; H01L21/66
Domestic Patent References:
| JP5258705A | ||||
| JP62173711A | ||||
| JP61065444A |
Attorney, Agent or Firm:
Keizo Nishiyama
Yuichi Uchio
Yuichi Uchio
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