Title:
SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2023155151
Kind Code:
A
Abstract:
To provide a substrate treatment system capable of supplying a treatment liquid including highly concentrated microbubbles to a substrate to be treated without generating large bubbles on the way to a supply line of the treatment liquid.SOLUTION: A substrate treatment system 50 includes a gas dissolved water generating tank 51, a chemical dilution module 52, and a substrate treatment module. The substrate treatment module includes a treatment liquid supply nozzle through which a treatment liquid is supplied to a substrate W. The treatment liquid supply nozzle has a decompression relief part that generates gas microbubbles from a diluted chemical solution. The treatment liquid supply nozzle supplies the diluted chemical solution including microbubbles in a step for scrubbing the substrate W.SELECTED DRAWING: Figure 2
Inventors:
TAKAHASHI HIROKI
ITO BAN
YIN SHENG GAO
SATO KOHEI
ITO BAN
YIN SHENG GAO
SATO KOHEI
Application Number:
JP2023005644A
Publication Date:
October 20, 2023
Filing Date:
January 18, 2023
Export Citation:
Assignee:
EBARA CORP
International Classes:
H01L21/304; B24B37/10; B24B53/017; B24B55/06; B24B57/02
Attorney, Agent or Firm:
Tetsuya Hirosawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa
Isamu Watanabe
Goto Manabu
Mitsuhiro Kanazawa