Title:
SUBSTRATE TYPE RESISTOR AND THERMAL FUSE
Document Type and Number:
Japanese Patent JP3770408
Kind Code:
B
Abstract:
PURPOSE: To enhance operation capability in relatively less heat generation of a film resistor and enhance insulation immediately after operation in a substrate type resistor and thermal fuse in which a film conductor and a film resistor are formed on one surface of a ceramic substrate, a low melting point metal piece is connected to the film conductor, and the film resistor and the low melting point metal piece are connected with the film conductor.
CONSTITUTION: A low melting point metal piece 3 is arranged in the middle of one surface of a ceramic substrate 1, film resistors 2, 2 are arranged on both sides of a center line n-n of the low melting point metal piece 3. Each end of the low melting point metal piece 3 and each inner side 21 of the film resistors 2, 2 are connected with middle film conductors 51 respectively. Lead film conductors 52 are formed between each outside end 22 of the film resistors 2 and the other end of the substrate 1 respectively. Lead wires 6 are connected to each lead film conductor respectively. One surface of the substrate 1 is covered with an insulating film 7.
Inventors:
Uemura, Mitsuaki
Application Number:
JP1994000189954
Publication Date:
February 17, 2006
Filing Date:
July 20, 1994
Export Citation:
Assignee:
UCHIHASHI ESTEC CO LTD
International Classes:
H01H37/76; H01H37/00; (IPC1-7): H01H37/76