Title:
SUBSTRATE WITH BUILT-IN COIL
Document Type and Number:
Japanese Patent JP2018198277
Kind Code:
A
Abstract:
To provide a substrate with a built-in coil, which can be thinned more than conventional ones.SOLUTION: A substrate 10 with a built-in coil according to the present invention has: a plurality of conductor layers 22 which are layered via interlayer insulating layers 21; spiral coil patterns 23 formed on the conductor layers 22; and coil parts 30 connecting the coil patterns 23 in the plurality of conductor layers 22. The coil parts 30 are provided with: a first coil parts 30A which connect the coil patterns 23 of the plurality of conductor layers 22 on one of the front/back of the substrate 10 with the built-in coil; and second coil parts 30B connecting the coil patterns 23 of the conductor layers 22 on the other side of the front/back of the substrate 10 with the built-in coil.SELECTED DRAWING: Figure 2
Inventors:
TANIGUCHI HIROTAKA
Application Number:
JP2017102818A
Publication Date:
December 13, 2018
Filing Date:
May 24, 2017
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H01F17/00; H05K1/16
Attorney, Agent or Firm:
Hiroshi Matsuura
Toshida Ikeda
Axami Kanako
Toshida Ikeda
Axami Kanako