Title:
SUBSTRATE WORK DEVICE AND SUBSTRATE WORK METHOD
Document Type and Number:
Japanese Patent JP2002270994
Kind Code:
A
Abstract:
To remove a carbon layer without performing troublesome positioning.
A device is provided with a first irradiation means 1 irradiating an insulation layer formed on a metallic layer of a substrate 7 with a first laser beam and a second irradiation means 2 irradiating a residual layer left on the metallic layer by the first laser beam emitted by the first irradiation means 1 with a second laser beam whose optical axis is matched with the first laser beam.
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Inventors:
KONO MASAYUKI
Application Number:
JP2001070443A
Publication Date:
September 20, 2002
Filing Date:
March 13, 2001
Export Citation:
Assignee:
CANON KK
International Classes:
B23K26/382; B23K26/16; H05K3/00; H05K3/46; B23K101/42; (IPC1-7): H05K3/00; B23K26/00; B23K26/16; H05K3/46
Attorney, Agent or Firm:
Yamashita