Title:
Substrate
Document Type and Number:
Japanese Patent JP6142627
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a variable capacitance module that prevents element breakdown due to heat.SOLUTION: A variable capacitance module includes: a variable capacitance element 10 mounted on a mounting substrate 30 and in which a capacitance value changes by applying a control voltage; and a control-voltage applying circuit 20 including a plurality of resistive elements R21 to R25 mounted on the mounting substrate 30, and applying a control voltage divided by the plurality of resistive elements R21 to R25 to the variable capacitance element 10. The variable capacitance element 10 has terminals 11 to 14, and the terminal 13 is connected to each of the resistive elements R21 to R25 of the control-voltage applying circuit 20. The terminal 14 is connected to the ground of a main substrate on which the variable capacitance module is mounted. The variable capacitance element 10 is mounted so that the terminal 14 is closer to any of the plurality of resistive elements R21 to R25 than the terminals 11 to 13.
Inventors:
Ueki travelogue
Application Number:
JP2013071099A
Publication Date:
June 07, 2017
Filing Date:
March 29, 2013
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G2/00; H01G7/06
Domestic Patent References:
| JP2011091691A | ||||
| JP2011119482A | ||||
| JP2007067407A | ||||
| JP2005210569A | ||||
| JP2008235775A | ||||
| JP2008289131A |
Foreign References:
| WO2013061985A1 | ||||
| WO2013183472A1 |
Attorney, Agent or Firm:
Kaede International Patent Office