Title:
パワーモジュール用基板およびパワーモジュール
Document Type and Number:
Japanese Patent JP7117960
Kind Code:
B2
Abstract:
To provide a substrate for a power module that is excellent in reliability.SOLUTION: A substrate 10 for a power module comprises: a ceramic substrate 1; and metal plates 2 that have opposing surfaces 2a opposite to a surface of the ceramic substrate 1 joined to the surface of the ceramic substrate 1 with a solder material 3, wherein an outer periphery of a first joint part 3a of the solder material 3 joined to the metal plate 2 is located on the inside of an outer periphery of the opposing surface 2a, and an outer periphery of a second joint part 3b joined to the ceramic substrate 1 is located on the outside of an outer periphery of the first joint part 3a. A power module 100 comprises the substrate 10 for a power module and an electronic component 11 mounted on the metal plate 2.SELECTED DRAWING: Figure 1
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Inventors:
Koji Hayakawa
Application Number:
JP2018182271A
Publication Date:
August 15, 2022
Filing Date:
September 27, 2018
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01L23/13; H01L25/07; H01L25/18; H05K1/02
Domestic Patent References:
| JP2016092049A | ||||
| JP2003318330A | ||||
| JP6263554A | ||||
| JP2015070107A | ||||
| JP2019106422A |
Attorney, Agent or Firm:
Patent business corporation HARAKENZO WORLD PATENT & TRADEMARK