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Title:
SUCTION DEVICE OF BALL-LIKE TERMINAL, MASK PLATE THEREFOR AND MOUNTING METHOD OF BALL-LIKE TERMINAL
Document Type and Number:
Japanese Patent JP3283026
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a suction device of a ball-like terminal which can mount a ball-like terminal readily by one suction plate on each terminal mounting pad of a number of electronic components formed in a substrate such as a semiconductor wafer.
SOLUTION: In a suction plate 14 to be mounted on a head part 12 constituting a suction device, a suction hole 22a which sucks a ball-like terminal is shaped corresponding to a terminal mounting pad in a division wherein the number of formed electronic components is maximum among a plurality of divisions dividing a substrate. A mask plate 24 which is formed by forming an opening part 26 following an outer circumferential shape of a specified division, so that a ball-like terminal is sucked only to suction holes 22a, 22a... corresponding to each terminal mounting pad of a group of electronic components formed in a specified division selected from a plurality of divisions among suction holes 22a, 22a... shaped in the suction plate 14, is mounted on one side of the suction plate 14.


Inventors:
Seigo Nakajima
Yoshiharu Fujimori
Application Number:
JP2000000658A
Publication Date:
May 20, 2002
Filing Date:
January 06, 2000
Export Citation:
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Assignee:
Shinko Electric Industry Co., Ltd.
Athlete FA Co., Ltd.
International Classes:
B23K1/00; B23K3/06; B23K35/14; B25J15/06; H01L21/48; H01L21/60; H01L23/12; H05K3/34; (IPC1-7): H01L23/12; B23K3/06; H01L21/60; H05K3/34
Domestic Patent References:
JP818209A
JP7251263A
JP8288288A
JP2000269257A
JP2000269253A
Attorney, Agent or Firm:
Takao Watanuki (1 outside)