Title:
銅合金板への高電流密度Snめっき用硫酸浴及びSnめっき方法
Document Type and Number:
Japanese Patent JP5410201
Kind Code:
B2
Inventors:
Ken Sakurai
Seiichi Ishikawa
Kenji Kubota
Takashi Tamagawa
Seiichi Ishikawa
Kenji Kubota
Takashi Tamagawa
Application Number:
JP2009195170A
Publication Date:
February 05, 2014
Filing Date:
August 26, 2009
Export Citation:
Assignee:
Mitsubishi Shindoh Co., Ltd.
International Classes:
C25D3/32; C25D17/06
Domestic Patent References:
| JP5171489A | ||||
| JP2001323392A | ||||
| JP9209188A | ||||
| JP61117297A |
Attorney, Agent or Firm:
Masakazu Aoyama