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Title:
SUPERABRASIVE GRAIN CUTTING GRINDSTONE
Document Type and Number:
Japanese Patent JPS63283866
Kind Code:
A
Abstract:

PURPOSE: To maintain the superior cutting performance by installing an annular network basic member into the outer periphery of a hub onto which a center installation hole is drilled and installing an abrasive grain fixation part in which the abrasive grains consisting of the superabrasive grains such as diamond as main constituent are fixed onto the outer peripheral edge of the network basic member by an adhesive.

CONSTITUTION: Abrasive grains 6 are fixed onto a network basic member 5 as supporting basic member for abrasive grains 6 by a resin group adhesive 7, and the basic member is constituted so that the opened ports of the network are left. Therefore, a number of cutting edges consisting of the abrasive grains 6 projecting from the adhesive layer act onto a workpiece, keeping buffer action performance. Further, since chips can be smoothly discharged, clogging can be prevented, and the superior cutting performance can be maintained. Further, since the balance due to the installation by a hub 3, kind of a network basic member 5, kind and application quantity of adhesive 7, and the fixation density of abrasive grains 6 can be adjusted, the captioned grindstone can be applied for a various sorts of workpieces and working modes.


Inventors:
ENDO YUKIO
MITANI KAZUYUKI
MATSUOKA TADASHI
UEKI MASAYOSHI
OTAKE YOSHIO
IKEZAKI YASUO
Application Number:
JP4468587A
Publication Date:
November 21, 1988
Filing Date:
February 27, 1987
Export Citation:
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Assignee:
TOSHIBA TUNGALOY CO LTD
KOYOSHA KK
SOZO KAGAKU KK
International Classes:
B24D5/12; B24D11/00; (IPC1-7): B24D5/12; B24D11/00
Domestic Patent References:
JP53093794B
JP30009549A
JPS5520445U1980-02-08