Title:
超伝導安定化材、超伝導線及び超伝導コイル
Document Type and Number:
Japanese Patent JP6642763
Kind Code:
B2
Abstract:
A superconductivity stabilizing material used for a superconducting wire and which is formed of a copper material containing at least one of additive elements selected from Ca, Sr, Ba, and rare earth elements in a range of 3 ppm by mass or more and 100 ppm by mass or less in total, with a remainder being Cu and unavoidable impurities, in which the total concentration of the unavoidable impurities, excluding O, H, C, N, and S which are gas components, is 5 ppm by mass or more and 100 ppm by mass or less, the half-softening temperature thereof is 200°C or lower, the Vickers hardness thereof is 55 Hv or more, and the residual resistance ratio (RRR) thereof is 50 or more and 500 or less.
Inventors:
Fukuoka
Yuki Ito
Kazumasa Maki
Yuki Ito
Kazumasa Maki
Application Number:
JP2019511670A
Publication Date:
February 12, 2020
Filing Date:
October 30, 2018
Export Citation:
Assignee:
Mitsubishi Materials Corporation
International Classes:
C22C9/00; H01B12/02
Domestic Patent References:
| JP2016125115A | ||||
| JP2014051709A | ||||
| JP63140052A | ||||
| JP2013216973A | ||||
| JP54097528A |
Foreign References:
| WO2017175713A1 | ||||
| CN1080779A | ||||
| WO2018037840A1 |
Attorney, Agent or Firm:
Yasushi Matsunuma
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami
Mitsuo Teramoto
Fumihiro Hosokawa
Kazunori Onami