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Patent Searching and Data


Title:
SUPERCRITICAL HEAT PUMP DEVICE
Document Type and Number:
Japanese Patent JP2006308278
Kind Code:
A
Abstract:

To improve a coefficient of performance of a supercritical heat pump device having a form for cooling a heating medium which is a heating object prior to heating of a heating medium.

This supercritical heat pump device is equipped with a refrigerant circuit 24 (first refrigerant circuit) for circulating the refrigerant R through a compressor 20 for compressing the refrigerant R up to a supercritical pressure, a heating condenser 21 for heating the heating medium W, an expansion mechanism 22 and an evaporator 23 for heat collection, and is provided with a pre-cooling means for cooling the heating medium W circulated through the heating condenser 21. The device is also provided with the second refrigerant circuit 29 for circulating the refrigerant R' through the second heating condenser 26 for heating the heating medium W which is a heating object, the second expansion mechanism 27 and a pre-cooling evaporator 28, together with the second compressor 25 for compressing the refrigerant up to a supercritical pressure and the heating condenser 21 in the refrigerant circuit, and is constituted so that the heating medium W which is the heating object is cooled by using the pre-cooling evaporator 28 in the second refrigerant circuit 29 as the pre-cooling means.


Inventors:
UCHIKAWA YASUO
Application Number:
JP2006089875A
Publication Date:
November 09, 2006
Filing Date:
March 29, 2006
Export Citation:
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Assignee:
UCHIKAWA YASUO
International Classes:
F25B1/00; F24H1/00; F25B5/02; F25B41/04
Attorney, Agent or Firm:
Shuichiro Kitamura