Title:
支持装置、基板処理装置及び基板処理方法
Document Type and Number:
Japanese Patent JP6594616
Kind Code:
B2
Inventors:
Jisanghyun
Application Number:
JP2014211845A
Publication Date:
October 23, 2019
Filing Date:
October 16, 2014
Export Citation:
Assignee:
AP Systems, Inc.
International Classes:
F27D5/00; F27D11/02
Domestic Patent References:
| JP9017742A | ||||
| JP11204237A | ||||
| JP2002175868A | ||||
| JP48016441U | ||||
| JP2007242709A | ||||
| JP2001199791A |
Attorney, Agent or Firm:
Maeda patent office