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Title:
支持装置、及び支持装置を含む基板処理装置
Document Type and Number:
Japanese Patent JP7309789
Kind Code:
B2
Abstract:
An apparatus for processing a substrate may include a process chamber providing a processing space in which a predetermined process may be performed on the substrate, and a supporting device contacting the process chamber and supporting the process chamber. The supporting device may include a supporting chamber providing a supporting space for supporting components of the process chamber and a supply member supplying a fluid into the supporting space.

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Inventors:
Lee Young Hee
Lee Sang Min
Im Wisan
Yoon Do Hyun
Application Number:
JP2021125727A
Publication Date:
July 18, 2023
Filing Date:
July 30, 2021
Export Citation:
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Assignee:
SEMES CO., LTD.
International Classes:
H01L21/304
Domestic Patent References:
JP2008072118A
JP2013033962A
Foreign References:
US20180366349
KR1020170039320A
KR101853377B1
KR1020130056758A
KR1020070076739A
KR10858933B1
Attorney, Agent or Firm:
Atsushi Honda



 
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