Title:
支持装置
Document Type and Number:
Japanese Patent JP7203888
Kind Code:
B2
Abstract:
To provide a support device capable of holding and fixing a matrix in an appropriate arrangement state in a step of plating and the like and precisely executing electroforming or a plating step on the matrix.SOLUTION: A support device includes a flat substrate part, a frame support part arranged to have a frame shape on the substrate part, and a contact part that can be electrically connected to a matrix for electroforming while being interposed between the substrate part and the frame support part.SELECTED DRAWING: Figure 3
Inventors:
Kiichiro Ishikawa
Hirohito Tamaru
Yoshihiro Kobayashi
Hirohito Tamaru
Yoshihiro Kobayashi
Application Number:
JP2021070229A
Publication Date:
January 13, 2023
Filing Date:
April 19, 2021
Export Citation:
Assignee:
Maxell Co., Ltd.
International Classes:
C25D1/00; C25D1/10; C25D17/08
Domestic Patent References:
| JP1215996A | ||||
| JP64090749A | ||||
| JP2005015908A | ||||
| JP2013142169A |
Foreign References:
| WO2016190180A1 |
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