SUPPORT JIG FOR SEMICONDUCTOR WAFER AND MANUFACTURING METHOD FOR THE SAME

Japanese Patent JP2016021527

A

PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor wafer supporting jig that is not an obstacle to safe mounting/demounting of a semiconductor wafer and can exclude a risk of inducing complexity of the construction of the jig and complication of the manufacturing process, and a manufacturing method for the same.SOLUTION: A semiconductor wafer supporting jig has a support board 10 confronting a thin semiconductor wafer 1, and plural adhesive layers 11 for adhesively holding the semiconductor wafer 1. The support board 10 is formed in the same shape as the semiconductor wafer 1, a part of the surface of the support board 10 is provided with plural adhesive layers 11 that are directly adhesively attached to the confronting surface of the semiconductor wafer 1 to compartment a space 12 between the confronting surface and the adhesive layers 11, and the plural adhesive layers 11 are arranged so that the space 12 compartmented by the semiconductor wafer 1 and the adhesive layers 11 is made to intercommunicate with the outside of the support board 10, thereby enabling air to flow through the space 12. The plural adhesive layers 11 are partially arranged and formed on a part of the surface of the support board 10 to suppress adhesive force, so that the thin and fragile semiconductor wafer 1 can be safely and easily exfoliated from the adhesive layers 11.SELECTED DRAWING: Figure 2

ODAJIMA SATOSHI

JP2014145245A

February 04, 2016

July 15, 2014

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SHINETSU POLYMER CO

H01L21/02; H01L21/683

JP2009016430A	2009-01-22
JP2003246357A	2003-09-02
JP2006351817A	2006-12-28
JPH05109879A	1993-04-30
JP2012169405A	2012-09-06

US8383460B1

2013-02-26

Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba

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