Title:
Support material structure for laminated modeling of solid models
Document Type and Number:
Japanese Patent JP6351840
Kind Code:
B2
Abstract:
Systems and methods for support structures for additive manufacturing of solid models. A method includes receiving a solid model, for a physical object to be manufactured, that includes a plurality of boundary representation surfaces. The method includes analyzing the b-rep surfaces to generate point samples for potential support locations. The method includes clustering points on the solid model, corresponding to at least some of the point samples, to create support locations. The method includes generating column supports in the solid model that connect to the original solid model at the support locations. The method includes storing the solid model, including the column supports.
More Like This:
Inventors:
Mark Earl. Bar Hop
David Maidley
Slazim swati
Elhan Arisoi
Edward Slavin
Hasan Bank
David Maidley
Slazim swati
Elhan Arisoi
Edward Slavin
Hasan Bank
Application Number:
JP2017517208A
Publication Date:
July 04, 2018
Filing Date:
June 11, 2015
Export Citation:
Assignee:
Siemens Product Lifecycle Management Software Inc.
International Classes:
G06F17/50; B29C64/40; B33Y10/00; B33Y50/00; B33Y80/00; G06T17/10
Domestic Patent References:
JP2002073705A | ||||
JP2003344042A | ||||
JP2003136605A |
Foreign References:
US20130124151 |
Attorney, Agent or Firm:
Einzel Felix-Reinhard
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Morita Taku
Junichi Maekawa
Hiroyasu Ninomiya
Ueshima
Previous Patent: A unified type flow measurement probe with which a time base range was extended
Next Patent: JPS6351841
Next Patent: JPS6351841