Title:
SUPPORT MATERIAL FOR WIRING AND PIPING
Document Type and Number:
Japanese Patent JP2007057101
Kind Code:
A
Abstract:
To easily and quickly connect a plurality of support materials for wiring and piping without applying machining measures such as opening holes in attachment positions by a drill, and to provide a support material for wiring and piping, which properly attaches various types of arrangement members to suitable positions.
In attachment tools (a fixing member 70 and a member 6 to be fixed) for connecting the support materials 100 for wiring and piping, and attaching the arrangement members, a housing passage 50 for housing the member 60 to be fixed is formed on the support material 100 for wiring and piping.
Inventors:
SHIMIZU SHOHACHI
Application Number:
JP2006274042A
Publication Date:
March 08, 2007
Filing Date:
October 05, 2006
Export Citation:
Assignee:
MIRAI IND
International Classes:
F16L3/22; F16L3/223; H02G3/00
Domestic Patent References:
JP2000125436A | 2000-04-28 | |||
JPS6417080A | 1989-01-20 | |||
JPS6042135Y2 | 1985-12-23 |
Attorney, Agent or Firm:
Takenori Hiroe