To provide a high-reliability semiconductor device, by reducing the warpage of a support disposed a sealing member.
The semiconductor device includes a support 100 having a pair of first conductor 101a and 101b, and a pair of a second conductor 102a and 102b which differ from the first conductor 101a and 101b, disposed on an insulation substrate 100a, and a sealing member 112, covering a semiconductor element disposed on the holder 100; the support 100 has an insulator with the insulation substrate exposed in between the pair of the first conductors; at least one of the pair of the second conductor is placed on the side of the insulator; and the sealing member is disposed on the region, including at least the first conductor or the second conductor.
SUGANO SHUSEN
MATSUMOTO KIMIKI
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