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Patent Searching and Data


Title:
SUPPORT FOR SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2009231847
Kind Code:
A
Abstract:

To provide a high-reliability semiconductor device, by reducing the warpage of a support disposed a sealing member.

The semiconductor device includes a support 100 having a pair of first conductor 101a and 101b, and a pair of a second conductor 102a and 102b which differ from the first conductor 101a and 101b, disposed on an insulation substrate 100a, and a sealing member 112, covering a semiconductor element disposed on the holder 100; the support 100 has an insulator with the insulation substrate exposed in between the pair of the first conductors; at least one of the pair of the second conductor is placed on the side of the insulator; and the sealing member is disposed on the region, including at least the first conductor or the second conductor.


Inventors:
ONO MASATO
SUGANO SHUSEN
MATSUMOTO KIMIKI
Application Number:
JP2009158335A
Publication Date:
October 08, 2009
Filing Date:
July 03, 2009
Export Citation:
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Assignee:
TOKUYAMA CORP
International Classes:
H01L23/02; H01L23/12; H01L33/48; H01L33/58; H01S5/022
Domestic Patent References:
JPH0679165U1994-11-04
JP2003347600A2003-12-05
JP2005235864A2005-09-02
JP2005538550A2005-12-15
JPH11177136A1999-07-02
JP2006324392A2006-11-30
JPH03178195A1991-08-02
JP2005210056A2005-08-04
JP2004253404A2004-09-09