Title:
支持構造、支持構造の印刷方法および印刷システム
Document Type and Number:
Japanese Patent JP6832445
Kind Code:
B2
Abstract:
An illustrative example support structure includes a solid portion printed using a first material and a non-solid portion printed using a second material. The solid portion includes a grid structure, and both inside and outside of each grid unit of the grid structure are filled with the non-solid portion. Hardness of the first material is different from hardness of the second material. A grid density of the grid structure varies within a printing plane, and/or an area of a cross-section of a connecting edge of the grid unit varies in a direction perpendicular to the printing plane. There are differences in strength of different portions of the support structure of the present disclosure, so that an adverse effect of cracking of the support structure caused by a stress concentration phenomenon occurring when the support structure is subjected to a stress during or after a curing process can be effectively prevented.
Inventors:
Chen Wei
Tokai Kiyoshi
Tokai Kiyoshi
Application Number:
JP2019547693A
Publication Date:
February 24, 2021
Filing Date:
May 16, 2017
Export Citation:
Assignee:
ZHUHAI SAILNER 3D TECHNOLOGY CO., LTD.
International Classes:
B29C64/40; B29C64/10; B29C64/393; B33Y10/00; B33Y30/00; B33Y50/02
Domestic Patent References:
| JP2016037040A | ||||
| JP2017007128A | ||||
| JP2003181941A | ||||
| JP5084834A | ||||
| JP2013536774A |
Foreign References:
| US5595703 | ||||
| CN105401724A | ||||
| US20160229127 | ||||
| US20150145169 |
Attorney, Agent or Firm:
Seiji Nishiuchi