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Title:
SUPPORT UNIT AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2022159242
Kind Code:
A
Abstract:
To provide a support unit and a substrate processing device capable of detecting abnormal operation of a heating member that heats a substrate or failure of a component that operates the heating member.SOLUTION: A support unit according to the present invention that supports a substrate, a rotatable chuck stage, a heating member disposed above the chuck stage and heating the substrate supported by the support unit, a power line that transmits power to the heating member, a window disposed above the chuck stage and forming an internal space in which the heating member is arranged, and an interlock module that interrupts the power delivered to the heating element when a set condition is satisfied.SELECTED DRAWING: Figure 9

Inventors:
SONG SOO HAN
KIM CHUL GOO
CHOI JUNG BONG
YUN KANG SEOP
Application Number:
JP2022060781A
Publication Date:
October 17, 2022
Filing Date:
March 31, 2022
Export Citation:
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Assignee:
SEMES CO LTD
International Classes:
H01L21/304
Domestic Patent References:
JP2020056095A2020-04-09
JPH07302778A1995-11-14
JP2005310940A2005-11-04
JP2014042027A2014-03-06
Foreign References:
US20210050235A12021-02-18
Attorney, Agent or Firm:
Ryoichi Takaoka
Nao Oda
Akiyo Iwahori
Rena Miyoshi
Kamoto Takahashi