Title:
SUPPORT OF WORKPIECE
Document Type and Number:
Japanese Patent JPH05218052
Kind Code:
A
Abstract:
PURPOSE: To quickly attain specified work temp. and keep specified temp. during working by applying a coating for assisting the heat conduction between a work and platen on the surface of the platen, so that the coating has an emissivity higher than that of the work. CONSTITUTION: This support comprises an enclosure 2, means for lowering the pressure in the enclosure 2, a platen 1 for supporting a work 3 in the enclosure 2, and a means 4 for heating the work 3 to over 300 deg.C. The surface of the platen 1 has a coating 7 for assisting heat conduction between the work 3 and platen 1. The coating 7 has an emissivity which is higher than that of the work 3. The work 3 is, e.g. a semiconductor wafer to be processed in a high vacuum, and the coating is a high-emissivity metal oxide such as Cr oxide of 25-50μm thickness.
Inventors:
MAIKERU JIYOSEFU KUUKU
AASAA JIYON MATSUKUJIEUN
AASAA JIYON MATSUKUJIEUN
Application Number:
JP20501091A
Publication Date:
August 27, 1993
Filing Date:
May 15, 1991
Export Citation:
Assignee:
ELECTROTECH LTD
International Classes:
F27D5/00; H01L21/203; H01L21/205; H01L21/302; H01L21/3065; H01L21/324; H01L21/683; F27D3/00; F27D7/06; F27D99/00; (IPC1-7): H01L21/203; H01L21/302; H01L21/324; H01L21/68
Attorney, Agent or Firm:
Aoki Akira (4 outside)
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