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Title:
SUPPORTING APPARATUS FOR BENDING MATERIAL
Document Type and Number:
Japanese Patent JPS5577931
Kind Code:
A
Abstract:

PURPOSE: To decrease moving distance and to simplify and automatize the operation at the time of moving to the next bending process, by returning bending material to the position before bending formation on occasion of returning on the stand after carrying out bending formation of bending material.

CONSTITUTION: Bending part of the bending material 2 is moved so as to be placed at the concave part 6 of the bottom die 5 and both sides are moved upwards together with bending of the material 2 when the top die 8 is descended. The rotation and buffer cylinder 18 is elongated by the above movement and is stuck on one side of the material 2 closely by rising up and rotating the support part 17 and then, the material 2 is supported. When bending formation is finished, the die 8 is risen and the part 17 is descended and is rotated by contracting the cylinder 18. The material 2 is descended rotating centering around the bending center P because the part 17 is rotated centering around the center P and the material 2 is placed on the stand 9 at the same position of placing position before the bending formation.


Inventors:
AMARI YASUMASA
Application Number:
JP15345178A
Publication Date:
June 12, 1980
Filing Date:
December 11, 1978
Export Citation:
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Assignee:
SHIN MEIWA IND CO LTD
International Classes:
B21D5/02; B21D5/04; (IPC1-7): B21D5/04
Domestic Patent References:
JPS5244271U1977-03-29
JP53133850B



 
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