Title:
SURFACE ACOUSTIC WAVE DEVICE AND ITS MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2005027229
Kind Code:
A
Abstract:
To obtain a means for downsizing a SAW device and lowering its back.
A surface acoustic wave device element is bonded to an insulating substrate through metal bumps by a flip chip method. An insulating resin is applied to the surface acoustic wave device element and the insulating substrate and is cured by heat to form the surface acoustic wave device which is provided with an airtight space between the surface acoustic wave device element and the insulating substrate. A multilayer metal film, composed of at least two layers, a first metal film exhibiting a high adhesiveness and a second metal layer, is provided on the outer surface of the insulating resin.
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Inventors:
OGAWA YUJI
Application Number:
JP2003270594A
Publication Date:
January 27, 2005
Filing Date:
July 03, 2003
Export Citation:
Assignee:
TOYO COMMUNICATION EQUIP
International Classes:
H01L23/29; H01L23/31; H03H3/08; H03H9/25; (IPC1-7): H03H9/25; H01L23/29; H01L23/31; H03H3/08