To provide an inexpensive surface acoustic wave device having good productivity for which sealing and metal film formation can be positively executed, and to provide a manufacturing method thereof.
In this surface acoustic wave device, an extender 5a extending from between an insulation substrate 1 and a piezoelectric substrate 6 to the middle part on an extensively provided portion 1a is provided on an annular bonding resin 5 for bonding the insulation substrate 1 and the piezoelectric substrate 6. Accordingly, the quantity of the bonding resin 5 cannot be reduced between the insulation substrate 1 and the piezoelectric substrate 6, the sufficient bonding resin 5 can be obtained, a vibration space 9 can be positively hermetically sealed, and a metallic film 10 to be provided on the external periphery of the bonding resin 5 can be positively formed. Accordingly, the vibration space 9 can be positively hermetically sealed with the bonding resin 5 and the metallic film 10, and can positively prevent permeation of moisture or gas into an interdigital electrode 7a by the metallic film 10.
Ichiro Suzuki
Hirohiro Ichimura
Kazuo Kobayashi