To provide a compact and inexpensive SAW(surface acoustic wave) device by eliminating the defects due to increasing processes for thickening the film of an Al electrode pad and destroying a chip or IDT(interdigital transducer) at the time of using a pyroelectric piezoelectric body in a conventional SAW device for joining a flip chip.

This flip chip type SAW device has a gold bump previously formed 3 at a land 2 provided on the internal bottom surface of a package 1 for continuing between a SAW element and an external terminal and joins an Al electrode pad 6 obtained by inverting a piezoelectric body chip 5 forming an IDT pattern and sticking it to a chip and the gold bump 3 to constitute the SAW device.