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Title:
SURFACE ACOUSTIC WAVE ELEMENT AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2009130806
Kind Code:
A
Abstract:

To provide a surface acoustic wave (SAW) element and manufacturing method thereof in which a frequency is highly accurately adjusted, and frequency stability is improved in a diamond SAW element coping with a frequency increase, in which an IDT is formed on a substrate of a diamond layered structure.

The SAW element 1 includes a substrate 2, interdigital electrodes 5a, 5b formed on the substrate 2 and an IDT constituted of the interdigital electrodes, wherein a principal surface of the substrate 2 is coated with Ta particles 12 the atomic weight of which is greater than 150 amu and the physical adsorption is reduced, between the interdigital electrodes 5a, 5b in such a degree as not to short-circuit the interdigital electrodes, so that the frequency of the SAW element is adjusted.


Inventors:
FUJII SATORU
YAMAZAKI TADASHI
UMEDA TAKATOSHI
YODA MITSUHIRO
FURUSHIMA YASUSHI
Application Number:
JP2007305825A
Publication Date:
June 11, 2009
Filing Date:
November 27, 2007
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
H03H3/10; H03H9/145
Domestic Patent References:
JPS5994910A1984-05-31
JP2006238211A2006-09-07
JPH11163655A1999-06-18
JP2003264448A2003-09-19
Attorney, Agent or Firm:
Kazuya Nishi
Masatake Shiga
Kazunori Onami



 
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