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Title:
SURFACE ACOUSTIC WAVE FILTER AND PRODUCTION METHOD THEREFOR
Document Type and Number:
Japanese Patent JP2002299999
Kind Code:
A
Abstract:

To provide a surface acoustic wave(SAW) filter, with which band suppression characteristics are satisfactory, and a production method, with which such characteristics (especially band suppression characteristics) can be controlled.

In a SAW filter S1, a SAW element, with which an exciting electrode 2 of SAW is formed on one principal side of a piezoelectric substrate 1, is housed in a casing 8 having an opening while turning one principal side of the piezoelectric substrate 1 downward, and the upper surface of the opening of the casing 8 is air-tightly sealed by a lid body 11. On the other principal side of the piezoelectric substrate 1, a dielectric layer 13 and a conductor layer 3 are successively laminated at least and at least one part of the lid body is formed from a translucent member 11a capable of irradiating the conductor layer 3 with light.


Inventors:
OHARA IKUO
ITO MIKI
NAGAMINE SHIGEHIKO
OTSUKA KAZUHIRO
Application Number:
JP2001096113A
Publication Date:
October 11, 2002
Filing Date:
March 29, 2001
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H03H9/25; H03H3/10; H03H9/145; (IPC1-7): H03H9/25; H03H3/10; H03H9/145