Title:
SURFACE-COATED CUTTING TOOL
Document Type and Number:
Japanese Patent JP2022150413
Kind Code:
A
Abstract:
To provide a surface-coated cutting tool exerting excellent cutting performance even when using the tool for high-speed intermittent cutting work of an alloy steel or the like.SOLUTION: In a surface-coated cutting tool in this invention, a coating layer has one or more of the laminate layer consisting of a laminate unit layer including α layer of a tool substrate side and β layer of a tool surface side. The α layer has an average layer thickness of 1.0 to 20.0 μm and includes the layer whose average composition is (AlxαTi1-xα)(CyαN1-yα) (here, xα:0.60-0.95 and yα:0.000-0.015), and a crystal grain area percentage of cubic crystal is 70% or more. The β layer has the average layer thickness of 0.5 to 5.0 μm and includes the layer in which its average composition is AlxβMeyβCzβN1-xβ-yβ-zβ(here, Me is one or more of Ti, Si, Zr, V, Cr, Nb, Hf and Mn); xβ/(xβ+yβ) is 0.70-0.95; zβ/(xβ+yβ) is 0.15∼3.00; and xβ+yβ is 0.15-0.60. The area ratio of the sum of grains of hexagonal and cubic crystals is less than 30%.SELECTED DRAWING: Figure 1
Inventors:
YANAGISAWA MITSUAKI
ISHIGAKI TAKUYA
NAKAMURA DAIKI
HONMA HISASHI
ISHIGAKI TAKUYA
NAKAMURA DAIKI
HONMA HISASHI
Application Number:
JP2021052999A
Publication Date:
October 07, 2022
Filing Date:
March 26, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
B23B27/14; C23C16/06
Attorney, Agent or Firm:
Koichi Kimura
Yasushi Yamada
Shuichi Kageyama
Yasushi Yamada
Shuichi Kageyama
Previous Patent: Method for producing hollow particles, method for producing hollow fibers
Next Patent: Method for manufacturing semiconductor parts
Next Patent: Method for manufacturing semiconductor parts