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Title:
SURFACE DRY TREATMENT AND ITS DEVICE
Document Type and Number:
Japanese Patent JPH03169013
Kind Code:
A
Abstract:
PURPOSE: To prevent the contamination of a wafer surface and to improve drying efficiency by substituting washing fluid with drying vapor and directly substituting washing fluid on a surface at a speed at which liquid drips do not remain. CONSTITUTION: The upper part of a container 12 is filled with drying vapor 32, and washing liquid 30 is partially filled as the boundary 34 of gas-liquid-solid is pushed downward through a wafer in a wafer instructing container 18 at an upper side. When saturated drying vapor flows into the container 12 and drying fluid is substituted for washing fluid from the wafer 16 on the boundary 34, drying fluid is mixed with washing fluid, and a clear drying fluid layer is formed on the upper part of washing fluid. The final washing fluid and drying fluid layer flows out of the container 12, and is made to flow into a boiler 14. When the boundary 34 drops at a sufficiently low speed, water/isopropanol boundary removes all water drops and the liquid drips of azeotrope from the wafer 16 as a liquid face drops. Thus, drying can be surely executed, without contaminating the surface of an object.

Inventors:
KURISUTOFUAA EFU MATSUKONERU
ARAN II UORUTAA
Application Number:
JP30635189A
Publication Date:
July 22, 1991
Filing Date:
November 24, 1989
Export Citation:
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Assignee:
C F M TECHNOL INC
International Classes:
F26B7/00; H01L21/304; (IPC1-7): F26B7/00; H01L21/304
Domestic Patent References:
JPS62245639A1987-10-26
JPS61152020A1986-07-10
JPS62198126A1987-09-01
JPS6323326A1988-01-30
JPH02291128A1990-11-30
Foreign References:
US4778532A1988-10-18
Attorney, Agent or Firm:
Shusaku Yamamoto



 
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