Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
平面研削盤および研削方法
Document Type and Number:
Japanese Patent JP7422424
Kind Code:
B2
Inventors:
Yukio Ozaki
Application Number:
JP2022110657A
Publication Date:
January 26, 2024
Filing Date:
July 08, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nisshin Industry Co., Ltd.
International Classes:
B24B7/04; B24B53/02; B24B49/16; B24B53/00; B24B53/12
Domestic Patent References:
JP2015020250A
JP63182860U
JP2008277602A
JP2011189456A
JP3154777A
JP2022187203A
Attorney, Agent or Firm:
Tadahiro Tatsumi



 
Previous Patent: gaming machine

Next Patent: System and program