PURPOSE: To form metal nitride as a surface hardened layer to a sufficient thickness by executing sputtering of the metals of groups IVa, Va, and VIa onto the surface of iron and steel and further subjecting the nitrides of the above metals to reactive sputtering.
CONSTITUTION: Sputtering of one kind among the metals of groups IVa, Va, and VIa, such as Ti, is applied to the surface of iron and steel, by which a Ti layer is formed. Subsequently, N2 gas is supplied and the nitride of the above metal is subjected to reactive sputtering, by which metal nitride as a surface hardened layer, such as TiN layer, is formed. By the presence of the intermediate layer of Ti, etc., the adhesive strength of the metal nitride in the surface hardened layer can be improved. Further, the intermediate layer acts as a buffer between the iron and steel and the metal nitride at the time of thermal expansion.
ITO HITOSHI
HIROSE KOJI
| JPS61177365A | 1986-08-09 | |||
| JPS54139891A | 1979-10-30 | |||
| JPS5625960A | 1981-03-12 |