Title:
表面検査方法および装置
Document Type and Number:
Japanese Patent JP4316853
Kind Code:
B2
Abstract:
A method and an apparatus of inspecting the surface of a wafer (2) where two or more kinds of laser are switched or mixed to make the laser (11, 12) incident on the film-coated wafer (2) by a same incident angle (θ1), in which inspection data regarding an inspection apparatus (1) and film parameters regarding a film are stored in storage means of the inspection apparatus (1) in an associated state with each other so as to obtain predetermined inspection conditions. When performing each measurement, an operator sets the film parameters of the wafer to be measured by setting means of the inspection apparatus (1). Thus, desired inspection conditions are automatically set in the inspection apparatus (1). The film parameters that the operator sets at each measurement are a film thickness and a film refraction index (Fig. 1).
Inventors:
Hisashi Isozaki
Yamazaki Rinkei
Hiroshi Yoshikawa
Takehiro Takase
Hiroshi Shida
Yoichiro Iwa
Yamazaki Rinkei
Hiroshi Yoshikawa
Takehiro Takase
Hiroshi Shida
Yoichiro Iwa
Application Number:
JP2002295613A
Publication Date:
August 19, 2009
Filing Date:
October 09, 2002
Export Citation:
Assignee:
Topcon Co., Ltd.
International Classes:
G01B11/30; G01N21/88; G01N21/956; G01N21/95; H01L21/66
Domestic Patent References:
| JP2002267416A | ||||
| JP2000155099A | ||||
| JP9145630A |
Attorney, Agent or Firm:
Toru Tanabe