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Title:
SURFACE MACHINING DEVICE AND SURFACE MACHINING METHOD FOR CYLINDRICAL WORK
Document Type and Number:
Japanese Patent JP2002292567
Kind Code:
A
Abstract:

To provide a surface machining device for a cylindrical work capable of reliably preventing a damage by abrasive grain on the opening end surface of the cylindrical work in a honing work process.

In the position where the relative positional relation in the cylindrical axial direction (X direction) between an opening end surface Wa of the cylindrical work W and a work seating surface 31 is close, a pressure fluid A supplied in the cylindrical work W is guided toward the whole periphery of the work seating surface 31 by a pressure fluid jetting direction guide means 60 so as to be jetted. By so doing, the abrasive grain or the like deposited on the whole periphery of the work seating surface 31 is swept by jetting force of the pressure fluid A, thereby precluding the possibility of a flaw on the opening end surface Wa including opening inner edge Wd of the cylindrical work W by the abrasive grain at seating.


Inventors:
MATSUO WATARU
NAKAZATO OSAMU
MORISHITA HIROYUKI
FUSHIKI TERUO
Application Number:
JP2001094601A
Publication Date:
October 08, 2002
Filing Date:
March 29, 2001
Export Citation:
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Assignee:
SHOWA DENKO KK
International Classes:
B24C3/00; B24B33/02; (IPC1-7): B24C3/00; B24B33/02
Domestic Patent References:
JPH11207623A1999-08-03
JPH10166137A1998-06-23
JPH01139871U1989-09-25
JPS472640A
JPH07285046A1995-10-31
JPH1190762A1999-04-06
JP2000127005A2000-05-09
JPH06335918A1994-12-06
Attorney, Agent or Firm:
Hisayoshi Shimizu (2 outside)