Title:
表面実装コンタクト
Document Type and Number:
Japanese Patent JP5023286
Kind Code:
B2
Inventors:
Tomohisa Kurita
Application Number:
JP2008270177A
Publication Date:
September 12, 2012
Filing Date:
October 20, 2008
Export Citation:
Assignee:
Kitagawa Industry Co., Ltd.
International Classes:
H01R13/24; H01R12/55
Domestic Patent References:
| JP2002015801A | ||||
| JP2007501498A |
Attorney, Agent or Firm:
Nagoya International Patent Service Corporation