Title:
SURFACE MOUNT ELECTRONIC PART AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3213794
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a surface mount electronic part on which the wettability of the solder on the edge face of a non-soldered external lead can be improved, and the board mounting strength by reflow soldering can be further improved.
SOLUTION: A resin package, in which an element and a plurality of inner leads, etc., which are electrically conducted to the element, are enveloped and a plurality of external leads 5, which are continuously extended to each inner lead from the side face of the above-mentioned resin package, are provided in the surface mount electronic part on which a horizontal part 6 is formed on the tip part of each external lead. The edge face 7 of the horizontal part 6 of the external lead 5 is connected to the bottom face of the horizontal part by a round part. Preferably, a plurality of streaks 9, which are extending in the vertical direction, are formed on the edge face 7 of the horizontal part.
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| JPS61134045 | RESIN-SEALED SEMICONDUCTOR DEVICE |
Inventors:
Kazutaka Shibata
Yasunobu Shoji
Yasunobu Shoji
Application Number:
JP19556195A
Publication Date:
October 02, 2001
Filing Date:
July 31, 1995
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L23/28; H01L21/48; H01L23/495; H01L23/50; H05K3/34; (IPC1-7): H01L23/50
Domestic Patent References:
| JP745769A | ||||
| JP832010A | ||||
| JP697346A |
Attorney, Agent or Firm:
Minoru Yoshida (1 person outside)