To reduce a package plane area in a surface mount piezoelectric oscillator having an externally mounted IC component, constituted of a bare chip, to a piezoelectric vibrator package, by making resin coating of an IC component with an underfill unnecessary, so as to reduce the overall size.

The piezoelectric oscillator includes a piezoelectric vibrator 2 having an insulating substrate 3 which includes an element mounting pad 4 electrically connected to each excitation electrode of a piezoelectric vibrator 2 on the upper face, and also an IC component mounting pad 5 on the bottom, a piezoelectric vibration device mounted on the element mounting pad, and a lid member 8 for air-tight sealing the above piezoelectric vibration device; an IC component 11 having an electrode electrically connected to the IC component mounting pad and constituting an oscillation circuit; and a flexible substrate 20 being adhered to at least a portion of an external face of the IC component, and also having a mounting terminal mounted on the bottom face in an exposed manner. The flexible substrate electrically conducts through the IC component mounting pad, the electrode of the IC component, and the mounting terminal.

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