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Title:
SURFACE-MOUNTED CHIP ANTENNA IMPROVED IN ELIMINATION CHARACTERISTICS OF SIGNAL INTERFERENCE, AND MOBILE COMMUNICATION DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2003347839
Kind Code:
A
Abstract:

To provide a surface-mounted chip antenna forming linear current paths therein by disposing a feeding pad and a short bar at respective facing surfaces to mutually oppose each other, and which is formed so as to dispose a generating position of the maximum current to be relatively distant from other circuits in a board, when it is mounted in a mobile communication device.

The surface-mounted chip antenna comprises an element body 51, having an upper surface 52a, a lower surface 52b, and four side surfaces 52c, 52d, 52e, 52f, a conductive feed pad 53 formed on the lower surface 52b and the first side surface, a conductive radiating electrode 54 formed on the upper surface 52a of the element body 51 and electrically connected to the feeding pad 53, a short bar 55 formed on a third side surface facing to the first side surface on which the feeding pad 53 is formed, and being connected to the conductive radiating electrode 54, and a ground electrode 56 formed on the lower surface 52b of the element body 51, spaced apart from the feeding pad 53 and connected to the short bar 55.


Inventors:
YOO SEUNG JONG
SUNG JAE SUK
Application Number:
JP2002374046A
Publication Date:
December 05, 2003
Filing Date:
December 25, 2002
Export Citation:
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Assignee:
SAMSUNG ELECTRO MECH
International Classes:
H01Q13/08; H01Q1/24; H01Q1/38; H01Q9/04; H01Q9/40; (IPC1-7): H01Q13/08; H01Q1/24; H01Q1/38; H01Q9/40
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)



 
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