Title:
SURFACE MOUNTED SEMICONDUCTOR CHIP PACKAGE
Document Type and Number:
Japanese Patent JPH05226507
Kind Code:
A
Abstract:
PURPOSE: To enhance the reliability of a device so as to avoid the production of residual flux during the flux cleaning step.
CONSTITUTION: Projecting outer terminals 161 formed on the surface attain the height size to the extent that they can make the gaps not to make melted down solder cause the capillary phenomenon between itself and a circuit board.
Inventors:
KITAOKA KOKI
MAEDA TAKAMICHI
MINAMIDE AKIZO
MAEDA TAKAMICHI
MINAMIDE AKIZO
Application Number:
JP6907092A
Publication Date:
September 03, 1993
Filing Date:
February 17, 1992
Export Citation:
Assignee:
SHARP KK
International Classes:
H01L23/12; H05K3/34; (IPC1-7): H01L23/12
Attorney, Agent or Firm:
Koji Onishi