To provide a surface-mounted type coil component that has realized space reduction suitable for reduction in profile of height and high-density mount.
A coil component 1 includes a core 3 having a wind part 4 and a collar part 5 and composed of a conductive material, an insulating case 2 in which an accommodation space 2a for accommodating the core 3 is formed, a terminal metal fitting 7 having a mounted part to be mounted on a mount surface W on a substrate and to be fixed mechanically on the case 2 in a state where at least part of the mounted part is exposed to the outside, and a winding that is connected to the terminal metal fitting 7 and at the same time, wound around the wind part 4 via the case 2, wherein the accommodating space 2a is defined by including a bottom surface 2A substantially parallel with the mount surface W, the wind part 4 and the collar part 5 have a lower surface of the wind part 4 and a low surface of the collar part 5, respectively, in opposition to the bottom surface 2A, the lower surface of the wind part 4 is in the same plane with respect to the lower surface of the collar part 5, a leg part 24 protruding toward the mount surface W is defined in a position in opposition to the collar part 5 of the case 2, and the mounted part of the terminal metal fitting 7 is arranged in the leg part 24.
SUZUKI HIROSHI
JP2007059649A | 2007-03-08 | |||
JP2007165407A | 2007-06-28 | |||
JPS59103316A | 1984-06-14 | |||
JPH02101513A | 1990-04-13 | |||
JPS62197825A | 1987-09-01 | |||
JP2005322688A | 2005-11-17 | |||
JPS599507A | 1984-01-18 | |||
JPH03112910A | 1991-05-14 |
Shin Koizumi
Akiko Ichikawa
Kunihiko Wakabayashi
Next Patent: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE