To provide a surface-mounted type LED which can ensure the reliability of a metal line connection part or the like of an LED chip, make the light emission wavelength of the LED uniform and reduce hue uneveness between radiation from the upper surface of the LED chip and radiation from the surface side thereof, and to provide its manufacturing method.

The LED has the LED chip 3 disposed on a substrate 1, a first light-transmitting resin layer 5 having a chip-sealing part 5a for sealing the LED chip 3 and a chip-sealing part enclosing part 5c provided higher than the height of the chip-sealing part 5a via a groove 5b in the circumference of the chip-sealing part 5a and a second light-transmitting resin layer 6 containing a fluorescent agent and formed inside the chip-sealing part enclosing part 5c.