Title:
SURFACE MOUNTING PART WITH LEAD TERMINALS
Document Type and Number:
Japanese Patent JPH06163791
Kind Code:
A
Abstract:
PURPOSE: To make further easier verification of soldering by increasing strength of lead terminals and making larger contact areas with a loading partner such as a wiring substrate.
CONSTITUTION: Lead terminals 12 of a surface mounting part 10 are formed like loops, the end supporting portions of terminals are also coupled with the surface mounting part body 11, contact portions with a wiring substrate 18 include almost linear contact portions 12C to ensure longer contact areas and the contact portions 12C are located at the external sides from the side surfaces 11A of the surface mounting part body 11 to ensure easier verification of the soldering.
Inventors:
TERATANI YASUSHI
Application Number:
JP31845992A
Publication Date:
June 10, 1994
Filing Date:
November 27, 1992
Export Citation:
Assignee:
KAWASAKI STEEL CO
International Classes:
H01L21/56; H01L23/28; H01L23/50; H05K1/18; H05K3/34; (IPC1-7): H01L23/50; H01L21/56; H01L23/28
Attorney, Agent or Firm:
Keisuke Matsuyama (2 outside)