Title:
SURFACE MOUNTING PART
Document Type and Number:
Japanese Patent JP2541133
Kind Code:
B2
Abstract:
PURPOSE: To intensity the peel strength of an electrode by constructing the soldering electrode of a surface mount part in U-shape.
CONSTITUTION: Fillets 5 to 5'' are formed on the soldering part which comes in contact with the copper foil seats 3 and 3' for electrode 1 and 1' on the printed board 4. To be more precise, two fillets are formed on each electrode. The peel strength of the electrodes 1 and 1' can be intensified by forming the soldering electrodes 1 and 1' of a mounting part 2 in U-shape structure as above-mentioned. Further the title surface mount part has the advantage of having a mounting density higher than that of conventional ones by decreasing the area of the copper foil seats 3 and 3'.
Inventors:
NOGUCHI KOSUKE
Application Number:
JP30448093A
Publication Date:
October 09, 1996
Filing Date:
December 06, 1993
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H05K1/18; H05K3/34; (IPC1-7): H05K1/18
Domestic Patent References:
| JP2189872A | ||||
| JP2278858A | ||||
| JP62281454A |
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)