Title:
SURFACE-MOUNTING RESIN-MADE HOLLOW PACKAGE AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP3734225
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin-made hollow package which efficiently radiates heat generated from a semiconductor element to the outside and is superior in bonding stability at packaging.
SOLUTION: The resin-made hollow package is composed of a hollow 20 having a bottom surface 4 for mounting a semiconductor element, leads 1, 2 for establishing electric conduction between the semiconductor element 7 mounted in the hollow 20 and a substrate 17, and a resin molding forming the package body 3. Its bottom surface comprises a package lower surface 5 located nearer to the hollow 20 than the bottom surface 6 of the package body.
Inventors:
Hoashi, Yukihiko
Yatabe, Mitsuo
Ogata, Takashi
Yatabe, Mitsuo
Ogata, Takashi
Application Number:
JP2005000093644
Publication Date:
October 28, 2005
Filing Date:
March 29, 2005
Export Citation:
Assignee:
YOSHIKAWA KOGYO CO LTD
International Classes:
H01L23/04