To connect a plurality of grounding upper electrodes via a conductor pattern as an inductance having a satisfactorily large value to obtain satisfactory attenuation characteristics, by arranging the conductor pattern functioning as inductance on a dead space positioned on the external peripheral edge of a mounting substrate without increasing the whole size, in an SAW filter provided with the mounting substrate of a planar structure.

This filter is provided with the mounting substrate 2 provided with a planar insulating substrate 3, a plurality of external electrodes 4 arranged on the lower part of the insulating substrate and upper electrodes 5; an SAW chip 10 provided with a piezoelectric substrate 11, a plurality of connection pads 12 formed on the lower surface of the piezoelectric substrate and mounted on each of the upper electrodes by flip chip via conductor pads, and a function portion pattern 13; and a sealing resin 20 for coating the entire external surface of the SAW chip. A closed-shape conductor pattern 30 for obtaining inductance is formed so as to surround the grounding upper electrodes on the external peripheral portion of the upper surface of the insulating substrate, and this conductor pattern is electrically connected to the grounding upper electrodes 5.