To provide a surface-mounting type electronic component of high reliability, which surely prevents a short between terminal electrode films due to peeling of a unnecessary plating film.

Terminal electrode films 12-14 formed by plating are provided on the surface of an electronic component main body. The terminal electrode films 12 and 14 are formed on both end parts of the electronic part main body 11, respectively. At terminal surfaces 11a and 11b of the electronic part main body 11, protective films 31 and 31 of resin are respectively formed before the terminal electrode films 12-14 are formed. Lead terminals 21a and 22a of an internal electrode exposed to the end surfaces 11a and 11b are coated with the protective films 31 and 31, so that at formation of the terminal electrode films 12-14, an unnecessary plating film is prevented from being formed at the lead terminals 21a and 22a.