To manufacture the BGA type surface packaged semiconductor device using lead frame capable of corresponding to high density wiring having multiple terminals.

An inner lead front part is sticked on the surface not in the inner lead raw material surface side using a lead framae 110 forming inner lead 112 thinner than the thickness of the raw material assuming one side as a lead frame raw material surface 112 and after sticking the whole sticked side by a fixing tape using an adhesive material, a semiconductor is mounted on the die pad surface in the lead frame raw material surface side of the inner lead. Next, a terminal (pad) 114 of the semiconductor element and the inner lead front end are electrically connected using a bonding wire 150 so that the whole region inside the outer frame 114 of the lead frame, after being sealed up with a sealing resin, a holding substrate, an outer frame part of the lead frame are removed to provide an outer electrode 180 made of solder balls on the surface of exposed outer terminal.